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  • BUMP SERIES

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    极限平特一肖公式规律 www.aytba.tw  

    Production Overview

    Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of wire bonding. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. 
    TFME offers various leading edge wafer bumping processes. WLP is a wafer level packaging technology which uses cu pillar or solder bumps to form the interconnection between the integrated circuit (IC) and the motherboard (or Lead Frame). WLP includes wafer bumping with or without Redistribution Layer (RDL), wafer level final test, wafer singulation and device packing in tape & reel to support full turn?key solution. TFME’s Under Bump Metallurgy (UBM) over PBO or PI layers on the die active surface provides a reliable interconnect solution to meet the demands of the growing global consumer market place for portable electronics.
    TFME offers customers with both 200mm and 300mm WLP Layout Design, Qualify and Mass Production services, including plated solder bump/Cu Pillar bump and ball placement technology with lead free materials.
     
    Application
    The WLP package family is applicable for a wide range of semiconductor device types from high end AP/PA/BB/RFIC chips, to Wireless LAN, card, switch, power management, memory, and standard analog, etc.
     
    Wafer Level Features
     * 4-256 ball count
    * Small body 0.64 mm2 to large 57.0 mm2 body size
    * PBO, Polyimide (PI) & LCP (low curing temperature polymer) Re-passivation and Re-distribution Layer (RDL) available
    * Cu Pillar. Solder bump and SAC Alloy ball-loaded bumping options
    * Reliable thick Cu RDL and Cu UBM with good electrical performance
    * Compatible with conventional SMT assembly and test techniques
     
    Die Level Features
     * Best in package level and board level reliability
    * Back-side lamination available
    * Cost effective T&R packaging solutions for small ICs
    * Full turnkey WLP, including probing and DPS
    * Wide selection of pocket tape carrier options

    Reliability Test Standards
    The test criterion is zero defect out of 77 sampling units.
    JEDEC Precondition MSL-1:J-STD-20/JESD22-A113
    Temp/Humidity Test 85°C/ 85% RH, 1000hrs, JEDEC 22- A101
    Pressure Cooker Test 121°C/ 100% RH/ 15 PSIG, 96hrs, JEDEC 22- A102
    Temp Cycle Test -65 ~ 150°C, 500cycles, JEDEC22-A104
    High Temp Storage Test  150°C, 1000hrs, JEDEC 22- A103  

    Bumping:

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    CopyRight 2015 All Right Reserved Tongfu Microelectronics Co., Ltd.
    地址:江苏省南通市崇川路288号 电 话:0513-85058888 传 真:0513-85058868
    备案号:苏ICP备05003519号

  • 山西:“四好农村路” 致富添门路 2019-05-25
  • 中国军队将参加“国际军事比赛 2019-05-25
  • 大豆自己种,芯片自己造 2019-05-25
  • 蔡英文赴美演讲就是要与大陆军事摊牌? 2019-05-24
  • 2011年4月环球时报总评榜研讨会(下) 2019-05-24
  • 空调还装墙壁上?聪明人都是往这里装,好看又省地 ——凤凰网房产 2019-05-23
  • 南通如皋为应对督察“回头看”违法掩埋危险废物 2019-05-23
  • 《只狼》亚太区将由方块游戏发行 包含简体中文 2019-05-23
  • 一语惊坛(5月15日):川航备降,是临危不惧的中国智慧的中国奇迹。 2019-05-22
  • 人民网春季糖酒会专访泸州老窖集团有限责任公司总裁、副董事长 孙跃 2019-05-22
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  • 贸易战不会让中美两国经济崩溃,只会让中美国经济更健康地发展。贸易战让市场全开放理论失败。这才是根本。 2019-05-21
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  • 山东2018年最低工资标准提高5.5% 2019-05-20